Flip chip bonding method - メーカー・企業と製品の一覧

[Technical Introduction] FCB Process

It can further reduce the implementation area compared to the COB method, enabling miniaturization on the PCB!

We would like to introduce the FCB process technology of Niigata Seimitsu Co., Ltd. The FCB process can accommodate a variety of mounting methods and various substrates. Additionally, we can comprehensively handle other processes related to the FCB process, such as substrate cleaning, dicing, and pickup, all in-house. 【Features】 ■ Formation of bumps on the electrode part of semiconductor chips (ICs) ■ Direct mounting on electrodes on printed circuit boards (PCBs) ■ A method of connecting by applying heat ■ Can achieve an even smaller mounting area than COB methods, enabling miniaturization on PCBs ■ Can also be combined with SMT for module miniaturization *For more details, please refer to the PDF document or feel free to contact us.

• 企業：新潟精密
• 価格：Other

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing